2010-06-28から1日間の記事一覧

http://www.fudzilla.com/home/news/latest/nintendo-dismisses-3ds-launch-rumours[Etc]

http://www.fudzilla.com/processors/processors/55w-quad-fusion-is-coming[CPU]

128GB BDXL Blu-ray spec finalised - SemiAccurate[Etc]

【MPSoC】マルチコア化で性能は本当に上がるのか,富士通研がオーバヘッドの評価手法整備に取り組む | 日経 xTECH(クロステック)[CPU]

http://eetimes.jp/news/4042[Etc]

Lattice joins move to widen use of FPGAs[FPGA]

EE Times | Electronic Engineering Times | Connecting the Global Electronics Community[FPGA]

Reduce parallel programming pain with dataflow languages | EE Times[SW]

http://www.elisnet.or.jp/news/news_detail.cfm?select_news_id=20302[FPGA]

http://www.elisnet.or.jp/news/news_detail.cfm?select_news_id=20301[Device]

「顧客の声には勝てない」,FreescaleがARMコア・マイコンに進出 | 日経 xTECH(クロステック)[CPU]

【#47DAC】今年は半導体ファウンドリの影響力とESL関連の話題が目に付く|EDA EXPRESS[EDA]

http://www.xbitlabs.com/news/cpu/display/20100622142829_Intel_Readies_Ten_Core_Microprocessor_for_Servers.html[CPU]

http://www.xbitlabs.com/news/cpu/display/20100622123052_AMD_to_Disclose_Details_About_Bulldozer_Micro_Architecture_in_August.html[CPU]

Technology News - CNET News - CNET[GPU]

GPU-accelerated video decoding comes to VLC media player - The Tech Report[GPU]

TechConnect Magazine - Technology news since 1997[GPGPU]

http://eetimes.jp/news/4039[GPU]

http://ednjapan.rbi-j.com/issue/2008/1/7/4421[Device]

EE Times | Electronic Engineering Times | Connecting the Global Electronics Community[EDA]

Electronics Component News | Design Engineers Electronics News | Electropages[FPGA]

http://www.fudzilla.com/processors/processors/intel-releases-fastest-dual-core-i3[CPU]

Core i3-370m

http://journal.mycom.co.jp/articles/2010/06/22/pica200/?rt=m&t=o&n=3042[GPU]

http://journal.mycom.co.jp/articles/2010/06/23/tsubame20_hard/?rt=m&t=o&n=3042[Device]

http://ednjapan.rbi-j.com/news/2010/6/6942[FPGA]

http://journal.mycom.co.jp/articles/2010/06/24/tsubame20_hard/?rt=m&t=o&n=3043[SW]

http://www.hpcwire.com/features/PathScale-Looks-to-One-Up-CUDA-OpenCL-with-New-GPU-Compiler-97089024.html?viewAll=y[SW]

多くの場合、SWエンジニアがコンパイラ作ってるから限界が…っていう。

http://www.ifixit.com/Teardown/iPhone-4-Teard[Etc]

気になるのはプレゼンでもあったけど、Step14のフレームを利用したアンテナ。

http://software.intel.com/en-us/blogs/2010/06/24/haskell-cnc-new-paper-available-tests-on-32-and-48-cores/[SW]

http://www.fudzilla.com/processors/processors/fusion-chipset-hudson-has-usb-30[Device]

まずAMDは上位だけ載せてくると。